Laser soldering and Dispensing machine HDL-10

Using laser light as a heat source and using a temperature sensor to achieve closed-loop temperature control, the solder paste is melted to complete soldering. It is applied to soldering of small parts, surrounding temperature-sensitive components, and large heat capacity.

  • Laser closed-loop temperature control, no substrate burning
  • Rapid heating, fast reaction time
  • Non-contact soldering, no mechanical stress
  • Equipped with dispensing head and solder paste
  • Multi-axis control, cycle time optimization

Specification:

Laser Soldering and Dispensing machine (HDL-10) 
Laser
TypeSemiconductor Laser
OscillationCW (Continuous Wave)
Wavelength915 nm
Output Power100W
Cooling SystemAir
Guide beamIncluded
Spot size1-7 mm adjustable
Thermometer
TypeInfrared
Temperature controlAvailable
Temperature control precision100°C- 300°C,± 2 °C (depends on material)
Measurement range100°C- 600°C
Dispenser
TypeScrew pump
Dispensing tip0.4 mm
Material viscosity35 kcps to 1300 kcps
Motor typeStepper
Minimum amount of glue0.00015cc
Motion
Number of axis10 (3X 4Y 3Z)
Speedup to 300mm/s
Resolution0.1 µm
Repeatability±0.02mm
Motor typeServo
CCD
CCD resolution300000
Coaxial Observation FunctionIncluded
Control
ControllerPC
SoftwareLabVIEW based
Dimension and Utilities
Dimensions W 1200 x D 950 x H 1750 mm
Weight 500 kg
PowerAC220V/1Φ/60Hz/4kW
Air0.6~0.7MPa,ψ6 tube

均鈺科技股份有限公司
電話:03-3756109 |傳真:03-3756108|地址:33463桃園市八德區和平路772巷20號
厚膜/代工產品諮詢:蔡先生 03-3756109 分機30 | tonytsai@hypro.com.tw

雷射設備產品諮詢:  鄭先生 03-3772789 分機13 | jack_ch_cheng@hypro.com.tw

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