利用雷射光當作熱源,搭配溫度感測器實現閉迴路溫度控制,將錫膏融化完成錫焊,應用於微小零件、周圍有溫度敏感元件、大熱容量的焊錫
利用雷射光當作熱源,搭配溫度感測器實現閉迴路溫度控制,將錫膏融化完成錫焊,應用於微小零件、周圍有溫度敏感元件、大熱容量的焊錫
Laser Soldering and Dispensing machine (HDL-10) | |
---|---|
Laser | |
Type | Semiconductor Laser |
Oscillation | CW (Continuous Wave) |
Wavelength | 915 nm |
Output Power | 100W |
Cooling System | Air |
Guide beam | Included |
Spot size | 1-7 mm adjustable |
Thermometer | |
Type | Infrared |
Temperature control | Available |
Temperature control precision | 100°C- 300°C,± 2 °C (depends on material) |
Measurement range | 100°C- 600°C |
Dispenser | |
Type | Screw pump |
Dispensing tip | 0.4 mm |
Material viscosity | 35 kcps to 1300 kcps |
Motor type | Stepper |
Minimum amount of glue | 0.00015cc |
Motion | |
Number of axis | 10 (3X 4Y 3Z) |
Speed | up to 300mm/s |
Resolution | 0.1 µm |
Repeatability | ±0.02mm |
Motor type | Servo |
CCD | |
CCD resolution | 300000 |
Coaxial Observation Function | Included |
Control | |
Controller | PC |
Software | LabVIEW based |
Dimension and Utilities | |
Dimensions | W 1200 x D 950 x H 1750 mm |
Weight | 500 kg |
Power | AC220V/1Φ/60Hz/4kW |
Air | 0.6~0.7MPa,ψ6 tube |