Different from the traditional monolithic IC, which uses a single material as the base material and is manufactured by crystal growth, photomask, and etching technology, a typical thick-film hybrid IC uses ceramics as the substrate of the circuit (the size is about 6 "×6"), the circuit and resistor elements are printed on the surface of the substrate using screen printing technology; other active or passive elements (such as TR , IC, Diode, Cap, Inductors, ASIC, etc.) are adhered to the ceramic substrate, then connected to the output pins, and finally packaged as a whole to form an application IC with complete functions and high confidentiality, which we call thick film hybrid integrated circuits (Thick Film Hybrid IC) or directly called Hybrid.